Microelectronics

Adhesion in Microelectronics by K. L. Mittal, Tanweer Ahsan PDF

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By K. L. Mittal, Tanweer Ahsan

This entire ebook will offer either primary and utilized elements of adhesion bearing on microelectronics in one and simply available resource. one of the themes to be coated include;

  • Various theories or mechanisms of adhesion
  • Surface (physical or chemical) characterization of fabrics because it relates to adhesion
  • Surface cleansing because it relates to adhesion
  • Ways to enhance adhesion
  • Unraveling of interfacial interactions utilizing an array of pertinent techniques
  • Characterization of interfaces / interphases
  • Polymer-polymer adhesion
  • Metal-polymer adhesion  (metallized polymers)
  • Polymer adhesion to numerous substrates
  • Adhesion of skinny films
  • Adhesion of underfills
  • Adhesion of molding compounds
  • Adhesion of other dielectric materials
  • Delamination and reliability matters in packaged devices
  • Interface mechanics and crack propagation
  • Adhesion dimension of skinny movies and coatings

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Extra resources for Adhesion in Microelectronics

Sample text

Depending on the specific coating-substrate system, the resultant failure in the scribe test can be cohesive or interfacial or mixed mode, in that cracks can be initiated within the coating, along the coating-substrate interface, or in the substrate. 2 Schematic of scribe test. Adhesion Measurement of Thin Films and Coatings 39 the substrate, and coating thickness. This can be better explained using the following simple model developed by Kendall [26]. 2 both the stylus and the substrate are made of same elastic materials and plastic and viscoelastic deformation in the system is neglected, Kendall found there are two competing events in the scribe test, namely the coating-to-substrate delamination and the shear fracture of coating itself.

Ramsier and P. N. Henriksen, Vibrational spectroscopy of phthalimides adsorbed on alumina: Models for polyimide adhesion, Appl. Spectroscopy, 44, 37–41 (1990). E. P. Plueddemann, Silane Coupling Agents, Plenum, New York (1982). K. L. ) Silanes and Other Coupling Agents, VSP, Utrecht, The Netherlands (1992). K. L. ) Silanes and Other Coupling Agents, Vol. 2, CRC Press, Boca Raton (2000). K. L. ) Silanes and Other Coupling Agents, Vol. 3, CRC Press, Boca Raton (2004). K. L. ) Silanes and Other Coupling Agents, Vol.

The critical load can be detected with the aid of optical or scanning electron microscopy after the test, or via simultaneous measurement of acoustic emission and electrical surface resistance. Depending on the specific coating-substrate system, the resultant failure in the scribe test can be cohesive or interfacial or mixed mode, in that cracks can be initiated within the coating, along the coating-substrate interface, or in the substrate. 2 Schematic of scribe test. Adhesion Measurement of Thin Films and Coatings 39 the substrate, and coating thickness.

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