Download e-book for kindle: Area Array Packaging Handbook: Manufacturing and Assembly by Ken Gilleo
By Ken Gilleo
It presents a good and helpful available quickly connection with the undefined. intensity of the content material is usually correct for advertising and administration those that want a few wisdom of the sphere. The e-book is although, too uncomplicated for digital Engineer. however, the photographs inside of will not be in stable solution. besides, if you would like an effective reference, it prevent a minimum of a number of days or even weeks time in looking web to your asked info.
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Additional resources for Area Array Packaging Handbook: Manufacturing and Assembly
Faster, more powerful CPUs have an increasing heat burden, and FCIP is one of the best designs for dealing with heat. This also suggests that FCIP for computer chips will continue to leave the back of the flip chip exposed for heat removal. We will continue to see much progress in the CSP area as more cost-effective products are introduced. While the popular CSPs, such as the Tessera BGA, are very reliable, many manufacturers seek lower-cost solutions using existing equipment. AMKOR and other packaging foundries, along with large vertically integrated electronics companies, continue to evolve lower-cost CSPs.
Rigid Carriers. Rigid carriers are the most common types of plastic package platform. The carrier is basically a miniature PWB that provides the chip mounting platforms and the wiring interconnect structure. FR4 has been used, but higher-performance organic laminates such as bismaleimide-triazine (BT) have become common. BT and other advanced laminates have more thermomechanical stability and heat resistance. The chip carrier is heated four or more times during its life: die attach, chip interconnect, solder ball attachment, and assembly to board.
Packages that are designed to handle these higher frequencies can be said to enhance performance. Enhanced performance goes beyond simply protecting the chip. Some characteristic of the total system should be improved over the results in a more standard package design. A package substrate with a low dielectric constant k would enable better signal transmission at higher frequencies and would fall into the enhancement class. Underfill is considered packaging material with performance-enhancing qualities.